Sinoteng series of products include crystal silica powder, fused silica powder, active silica powder, spherical silica powder, rounded corner silica powder, and electronic grade glass powder, which are suitable for electronics and electrical appliances. According to customer needs, our company can provide customers with product improvement and use solutions.

1) Epoxy molding compound (EMC)

Electronic devices in the field of electronics and electrical appliances are usually encapsulated with epoxy plastic (EMC). Sinoteng series products can be used as fillers in epoxy plastics, which can increase the strength and thermal conductivity of components, save resin and reduce costs; such as crystal Silica powder, fused silica powder, active silica powder, spherical silica powder, round-corner silica powder series powder materials can be used as excellent fillers for conventional purposes. In addition, spherical silica powder is widely used in advanced semiconductor device packaging due to its high filling, high flow, low wear and low stress characteristics. In particular, spherical silica powder that controls coarse particles can also be used for epoxy molding compounds for liquid packaging, as well as fillers for liquid packaging resins such as Under filler and Globe top, and as fillers for various resin substrates.

2) Integrated circuit (IC)

Capacitance and resistors devices in the field of electronics and electrical appliances are packaged  with epoxy packing material. Sinoteng silica powder series products are normally used as additive materials for epoxy packing materials.

3) Copper Clad Laminate CCL

Printed circuit boards in the fields of electronics and electrical appliances often use copper clad laminates (CCL) as substrates, and the addition of ultra-fine silica powder and spherical silica powder can be used as fillers to improve the heat resistance and reliability of copper clad laminates, and to increase product strength Larger and better thermal conductivity to reducing the possibility of source errors in integrated circuits: Sinoteng product : Super-fine crystal silica powder, fused silica powder and spherical silica powder series products can be used as copper clad laminates.

4) Printed circuit board PCB

Printed circuit board ink is a protective material for electronic circuit boards. Sinoteng super-fine silica powder and spherical silica powder can be used as fillers to provide scratch resistance, low thermal expansion coefficient and chemical resistance for circuit boards.

5) Thermal interface materials

The miniaturization of electronic products makes thermal management very necessary. The thermal interface materials (TIM) can fill the air gap caused by the uneven contact surface of the electronic product component, so that the heat dissipation capacity can be improved. Thermally conductive gaskets or thermally conductive silicone grease are normal thermal interface materials, and super fine crystals silica powder, fused silica powder, spherical silica powder, etc. can be used as fillers and are an important part of thermally conductive gaskets or thermally conductive silicone grease.

6) Optical fiber

With the rapid development of the microelectronics industry, it is required not only to be ultrafine, but also to have high purity and low content of radioactive elements,  especially for the spherification of particle shape. Optical fiber communication is a modern communication method that can provide large-capacity, high-speed, and high-quality communication services. The main component of the optical cable used in optical fiber communication is optical fiber. Sinoteng series spherical silica powder has smooth surface, large specific surface area, high hardness, stable chemical properties, low expansion coefficient, good liquidity, excellent mechanical properties, high dielectric, high heat resistance, high humidity resistance, high filling content, low impurities , Low friction coefficient  and other unique properties. It can be used as a filling material for optical fiber application.